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Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
Specification C8WT728
SSC
Drawn Approval
CUSTOMER
Approval
Rev. 03 June 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
CONTENTS
1. 2. 3. 4. 5. 6. 7. 8. 9.
Description Absolute Maximum Ratings Electro-Optical Characteristics Optical characteristics Reliability Test Color & Binning Bin Code Description Outline Dimension Reel Structure
10. Packing 11. Soldering 12. Precaution for use 13. Handling of Silicone Resin LEDs
Rev. 03 June 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
C8WT728
1. Description TOP VIEW LED is designed for high current operation and high flux output applications. Furthermore, its thermal management characteristic is better than other LED solutions by package SMD design and good thermal emission material. According to these advantages, it enables to apply various lighting applications and design solution, automotive lighting etc.
* * *
C8WT728
Features
White & Warm colored SMT package. * * High CRI PKG Pb-free Reflow Soldering Application * Suitable for all SMT assembly methods ; Suitable for all soldering methods RoHS Compliant MSL LEVEL 2a
Applications
* * * Interior lighting General lighting Indoor and out door displays * Architectural / Decorative lighting
Rev. 03 June 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
2. Absolute maximum ratings
Parameter Power Dissipation Forward Current Peak Forward Current (Per die) Reverse Voltage (per die) Operating Temperature Storage Temperature Symbol Pd IF IFM
*2
Value 324 90 100 5 -40 ~ +85 -40 ~ +100
Unit mW mA mA V C C
VR Topr Tstg
*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW 1msec of pulse width and D 1/10 of duty ratio.
3. Electric & Optical characteristics
Parameter Forward Voltage (per die) Reverse Current (per die) Luminance Intensity *1 [4,700 ~ 7,000 K] Luminance Intensity *1 [2,600 ~ 4,700 K ] Luminance Flux [CIE X = 0.31, Y = 0.31] Color Temperature Optical Efficiency Viewing Angle
*2
Symbol VF IR IV IV V CCT
Condition
IF =20mA VR=5V IF =60mA IF =60mA IF =60mA
Min 3.0 4.0 4.0 2,600
Typ 3.3 5.2 5.0 16.5
Max 3.6 10 7,000
Unit V A cd cd lm K lm/W deg
elc
21/2 Ra
IF =60mA IF =60mA IF =60mA
-
83 120 83
-
Color Rendering Index
*1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is 10% *2. 21/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC.
Rev. 03 June 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00)
Relative luminouce Flux [lm]
2.5 3.0 3.5 4.0
Forward Current [mA]
Forward Current IF[mA]
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
10
35 30 25 20 15 10 5 0
4. Optical characteristics
Forward Voltage vs. Forward Current (Per die)
Forward Current vs. Relative Luminous Intensity
2.5
2.0
1.5
1.0
0.5
1 2.0
0.0
0
50
100
150
200
Forward Voltage[V]
Forward Current IF[mA]
Ambient Temperature vs. Maximum Forward Current (per die)
Directivity
0 -30 30
-60
60
-90
-25 0 25 50
O
90
75
100
A m bient tem p erature Ta( C )
Rev. 03 June 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
5. Reliability Test
Number of Damaged
0/22 0/22 0/22 0/22 0/22
Item
Reference
EIAJ ED-4701 EIAJ ED-4701 EIAJ ED-4701 EIAJ ED-4701 Internal Reference Internal Reference Internal Reference Internal Reference MIL-STD883D
Test Conditions
Ta =-40oC(30min) ~ 100oC(30min) Ta =100oC Ta =60oC, RH=90% Ta =-40oC Ta =25oC, IF =60mA Ta =60oC, RH=90%, IF =60mA
Duration / Cycle
1000 Cycle 1000 Hours 1000 Hours 1000 Hours 1000 Hours 500 Hours 1000 Hours
Thermal Shock High Temperature Storage High Temp. High Humidity Storage Low Temperature Storage Operating Endurance Test High Temperature High Humidity Life Test
0/22
High Temperature Life Test Low Temperature Life Test ESD(HBM)
Ta =85oC, IF =60mA Ta =-40oC, IF =60mA 1KV at 1.5k; 100pF
0/22 0/22 0/22
1000 Hours 3 Time
CRITERIA FOR JUDGING THE DAMAGE Item
Forward Voltage Reverse Current Luminous Intensity
Symbol
VF IR IV
Condition
IF =60mA (20mA per die) VR=5V IF =60mA (20mA per die)
Criteria for Judgment MIN
LSL*2 x 0.5
MAX
USL*1 x 1.2 USL*1 x 2.0 -
Note : *1 USL : Upper Standard Level *2 LSL : Lower Standard Level
Rev. 03 June 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00)
CIE (y)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
6. Color & Binning
0.9 0.8 0.7
505 515 510 520 525 530 535
540
545
550 555 560 565 570 575 580 585 590 595 600 610 620 630 830
0.6
500
0.5 0.4 0.3 0.2 0.1 0.0 0.0
495
490 485 480 475 470 460
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
Rev. 03
CI E(x)
June 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00)
CIE Y
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
6. Color & Binning
0.44 0.42 0.40 0.38 0.36 0.34 0.32 0.30
ENERGY STAR RANK (7000K~2600K)
2700K2600K 2900K 3000K 3200K H1 H3 G3 3500K G1 3700K F3 H4 H2 4000K F1 G4 E3 G2 4200K F4 4500K E1 F2 4700K D3 E4 5000K D1 E2 5300K C3 D4 C1 D2 5600K C4 6000K B2 C2 6500K B1 Z 7000K A2 A1 Y X
0.28 0.28
0.30
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
CIE X
Rev. 03 June 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
6. Color & Binning
COLOR RANK

7000 ~ 6500 K A1 CIE X CIE Y
0.3028 0.3068 0.3145 0.3117 0.3304 0.3113 0.3187 0.3393
6500 ~ 6000 K A2 CIE X CIE Y
0.3117 0.3145 0.3221 0.3205 0.3393 0.3187 0.3261 0.3481
6000 ~ 5600 K B1 CIE X CIE Y
0.3207 0.3222 0.3294 0.3292 0.3462 0.3243 0.3306 0.3539
5600 ~ 5300 K B2 CIE X CIE Y
0.3292 0.3294 0.3366 0.3376 0.3539 0.3306 0.3369 0.3616
5300 ~ 5000 K C1
CIE X 0.3376 0.3371 0.3451 0.3463 CIE Y 0.3616 0.349 0.3554 0.3687 CIE X 0.3371 0.3366 0.344 0.3451
5000 ~ 4700 K C2
CIE Y 0.349 0.3369 0.3428 0.3554 CIE X 0.3463 0.3451 0.3533 0.3551
C3
CIE Y 0.3687 0.3554 0.362 0.376 CIE X 0.3451 0.344 0.3515 0.3533
C4
CIE Y 0.3554 0.3428 0.3487 0.362
7000 ~ 6000 K X CIE X CIE Y
0.3104 0.3068 0.3221 0.3234 0.294 0.3113 0.3261 0.3105
6000 ~ 5300 K Y CIE X CIE Y
0.3234 0.3222 0.3366 0.3365 0.3105 0.3243 0.3369 0.3258
5300 ~ 4700 K Z CIE X CIE Y
0.3365 0.3366 0.3515 0.35 0.3258 0.3369 0.3487 0.34
A~C, X~Z -> CCT 4700 ~ 7000 K
Rev. 03 June 2009
* Measurement Uncertainty of the Color Coordinates : 0.01
www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
6. Color & Binning
COLOR RANK

4700 ~ 4500 K D1 D2 CIE X CIE Y CIE X CIE Y
0.3548 0.3529 0.3615 0.3641 0.3736 0.3597 0.3659 0.3804 0.3529 0.3512 0.359 0.3615 0.3597 0.3465 0.3521 0.3659
4500 ~ 4200 K D3 CIE X
0.3641 0.3615 0.3702 0.3736
D4 CIE Y
0.3804 0.3659 0.3722 0.3874
CIE X
0.3615 0.359 0.367 0.3702
CIE Y
0.3659 0.3521 0.3578 0.3722
4200 ~4000 K E1
CIE X 0.3736 0.3702 0.3825 0.3869 CIE Y 0.3874 0.3722 0.3798 0.3958 CIE X 0.3702 0.367 0.3783 0.3825
4000 ~ 3700 k E2
CIE Y 0.3722 0.3578 0.3646 0.3798 CIE X 0.3869 0.3825 0.395 0.4006
E3
CIE Y 0.3958 0.3798 0.3875 0.4044 CIE X 0.3825 0.3783 0.3898 0.395
E4
CIE Y 0.3798 0.3646 0.3716 0.3875
3700 ~ 3500 K F1 CIE X
0.3996 0.3941 0.408 0.4146
3500 ~ 3200 K F2 F3 CIE Y
0.3848 0.369 0.3751 0.3916
F4 CIE Y
0.4089 0.3916 0.3984 0.4165
CIE Y
0.4015 0.3848 0.3916 0.4089
CIE X
0.3941 0.3889 0.4017 0.408
CIE X
0.4146 0.408 0.4221 0.4299
CIE X
0.408 0.4017 0.4147 0.4221
CIE Y
0.3916 0.3751 0.3814 0.3984
3200 ~3000 K G1
CIE X 0.4299 0.4221 0.4342 0.443 CIE Y 0.4165 0.3984 0.4028 0.4212 CIE X 0.4221 0.4147 0.4259 0.4342
3000 ~ 2900 k G2
CIE Y 0.3984 0.3814 0.3853 0.4028 CIE X 0.443 0.4342 0.4465 0.4562
G3
CIE Y 0.4212 0.4028 0.4071 0.426 CIE X 0.4342 0.4259 0.4373 0.4465
G4
CIE Y 0.4028 0.3853 0.3893 0.4071
2900 ~ 2700 K H1 H2 CIE X CIE Y CIE X CIE Y
0.4562 0.4465 0.4582 0.4687 0.426 0.4071 0.4099 0.4289 0.4465 0.4373 0.4483 0.4582 0.4071 0.3893 0.3919 0.4099
2700 ~ 2600 K H3 CIE X
0.4687 0.4582 0.47 0.4813
H4 CIE Y
0.4289 0.4099 0.4126 0.4319
CIE X
0.4582 0.4483 0.4593 0.47
CIE Y
0.4099 0.3919 0.3944 0.4126 Rev. 03 June 2009
D~H -> CCT 2600 ~ 4700 K
* Measurement Uncertainty of the Color Coordinates : 0.01
www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
M0 M5 N0 N5 P0
7. Bin Code Description Bin Code
Luminous Intensity [mcd] M0 Color Rank A1 Forward Voltage [V] Z1
4,700K ~ 7,000K 4,700K
Luminous Intensity [mcd] @ IF = 60mA RANK Min. 4,000 4,500 5,000 5,500 6,000 Max. 4,500 5,000 5,500 6,000 6,500 Color Rank @ IF = 60mA A1 B1 C1 C3 X Z A2 B2 C2 C4 Y Average for Total Forward Voltage [V] @ IF = 60mA RANK Z1 Z2 Z3 A1 A2 Min. 3.0 3.1 3.2 3.3 3.45 Max. 3.1 3.2 3.3 3.45 3.6
2,600K ~ 4,700K 2,600K
Color Rank @ IF = 60mA D1 D3 E1 E3 F1 F3 G1 G3 H1 H3 D2 D4 E2 E4 F2 F4 G2 G4 H2 H4 Rev. 03 June 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
8.Outline Dimension
Package Outlines
6
5
4
Package Marking (Cathode)
Front View
1
2
3
Right View
Rear View
( Tolerance: 0.2, Unit: mm )
Circuit Diagram
R ecom m ended S o ld e r P a d
White Anode 6 5 4
W1
1
W2
2
W3
3
White Cathode
* MATERIALS PARTS Package Encapsulating Resin Electrodes MATERIALS Heat-Resistant Polymer Silicone Resin Ag Plating Copper Alloy
Rev. 03 June 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00)
80.1
5.3
(4.75)
22 13
1)Quantity : 1,000pcs/Reel 2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be 0.2mm 3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10 to the carrier tape 4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package
( Tolerance: 0.2, Unit: mm )
60
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
40.1 20.05 0.3-0.05
5.50.05
1.750.1 12.00.2
9. Reel Structure
,-0 0.1 .5+ ?1
5.70.1 2.10.1
Package Marking
180
15.41.0 130.3
2
Rev. 03
June 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
10. Packing
Reel
QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR DESI PAK
Aluminum Vinyl Bag
QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B)) TYPE SIZE (mm) c a b 245 220 102 7inch 245 220 142
1 SIDE c
TUV
MADE IN KOREA
QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
Acriche
RoHS
1
Semiconductor EcoLight
b a
Rev. 03 June 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
11. Soldering
(1) Lead Solder
Lead Solder Pre-heat Pre-heat time Peak-Temperature Soldering time Condition 120~150 120 sec. Max. 240 Max. 10 sec. Max.
120sec. Max. 2.5~5 C / sec. Lead Solder 2.5~5 o C / sec. Pre-heating 120~150 oC 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC
(2) Lead-Free Solder
Lead-free Solder
Lead Free Solder Pre-heat Pre-heat time Peak-Temperature Soldering time Condition 150~200 120 sec. Max. 260 Max. 10 sec. Max.
1~5 oC / sec.
1~5 oC / sec. Pre-heating 150~200 o C
260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC
120sec. Max.
(3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315C under soldering iron.
(4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used.
[Note] In case that the soldered products are reused in soldering process, we don't guarantee the products.
Rev. 03 June 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
12. Precaution for use
1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5C ~30C Humidity : maximum 65%RH 2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; a. After opened and mounted the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40C Humidity : less than 30% 3) In the case of more than 4 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 605C. 4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. 5) Quick cooling shall be avoided. 6) Components shall not be mounted on warped direction of PCB. 7) Anti radioactive ray design is not considered for the products. 8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. 9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. 10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. 11) The LEDs must be soldered within seven days after opening the moisture-proof packing. 12) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. 13) The appearance and specifications of the product may be modified for improvement without notice.
Rev. 03 June 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
13. Handling of Silicone Resin LEDs
1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound.
2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched.
3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED's reflector area. 4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. 5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. 6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space.
Rev. 03 June 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00)

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